ArF light source
Resolution
Projection optics
Wafers per hour
Key features & benefits
Chipmakers use the TWINSCAN NXT:1980Fi to print mid-critical chip layers – those just above the most sensitive transistor layers – in both advanced and mature semiconductor nodes. This system is designed for our customers who want faster printing and higher throughput to make their operations run more cost efficiently.
With ASML’s immersion technology at its core, the NXT:1980Fi offers a resolution of 38 nm, 2.5 nm machine-matched overlay and a throughput of 330 wafers per hour. The system benefits from a series of structural improvements that were introduced in the latest NXT platform and allow the system to run at extremely high speeds without compromising on overlay or resolution.
Faster stages are in large part behind the NXT:1980Fi’s increased productivity. Design improvements to the immersion hood, a complex component that helps control the water in immersion systems, reduce defects. And enhancements in the control of optical heating effects increase the system’s productivity by maintaining its overlay accuracy.
