Wafer Metrology & inspection systems

Our YieldStar optical metrology solutions for the semiconductor industry can quickly and accurately measure the quality of patterns on a wafer.

Fast, accurate optical metrology of in-device overlay for post-etch process monitoring

The YieldStar 500 is a stand-alone optical wafer metrology system for measuring pre-etch overlay leveraging ASML’s innovative TWINSCAN stage.

Our HMI e-beam solutions help to locate and analyze individual chip defects amid millions of printed patterns.

The first generation multiple e-beam (multibeam) wafer inspection tool for in-line defect inspection applications

The world’s first multiple e-beam (multibeam) wafer inspection tool.

Flexible e-beam inspection solution that detects multiple defect types in one system.

Our highest resolution e-beam system offers CD metrology and defect detection for chip development and production monitoring.