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ASML TWINSCAN NXT:400M DUV lithography machine

TWINSCAN XT:400M

The dual-stage i-line dry lithography system prints 200 mm and 300 mm wafers with ≤ 20 nm overlay across the entire wafer.

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Mercury vapor light source

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Resolution (nm)

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Projection optics

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Wafers per hour

Key features & benefits

The TWINSCAN XT:400M is the successor to the XT:400L and offers increased productivity for mature-technology markets.

Chipmakers can easily integrate the XT:400M into their fabs because the system’s improvements don’t require extra process changes. That makes upgrading from an older machine easy – chipmakers can quickly get the XT:400M up and running using their existing routines. Like the XT:400L, the system can reach a resolution of 220 nm with an optional hardware add-on. 


The system’s hardware upgrades include improvements to the optical column. By leveraging the latest optical advances, the XT:400M offers better transmission through the optical column, which increases the system’s productivity.


Software improvements help to increase the system’s yield. Previous XT:400 machines used TWINSCAN Overlay Package 2 (TOP-2), which improved the overlay – that is, how accurately one layer can be printed on top of the previous one – from 35 nm to 20 nm. But those values apply only to inner fields and not at the wafer’s edge. The XT:400M uses TOP-2F, where F stands for ‘full wafer’. With this optional software, the system can reach the same 20 nm overlay across the entire wafer. The result is more usable chips per wafer and, therefore, higher yield.