TSMC places order with ASML for advanced 300 mm technology

ASML today announced that it has received an initial order for its new 300 mm technology platform from TSMC, a world leading IC foundry company. The first shipments include DUV (248 nm) and i-line (365 nm) systems to be installed in TSMC's 300 mm pilot line in Tainan, Taiwan.

"We are very pleased that TSMC has selected our new advanced technology for their planned 300mm volume foundry operation," said Dave Chavoustie, ASML's executive vice president of worldwide sales. "This order represents a solid endorsement of our comprehensive technology leadership from the world's recognized leading foundry manufacturer."

Dr. N.S. Tsai, senior director of TSMC's 300 mm pilot line, said, "TSMC has put together a strong team dedicated to developing 300 mm technology and has had each module in readiness for production. The installation of ASML's new 300 mm technology platform will further boost TSMC lithography technology competitiveness and will therefore help TSMC to become one of the first IC companies to start 300 mm wafer volume production in the near future."

The new platform is specifically designed for 300 mm wafers and provides fundamental innovations in system architecture and stage design to meet the highest productivity requirements. It is designed to support multiple generations of optical lithography technologies from i-line to 157 nm. The first shipment is scheduled for the third quarter of this year. ASML plans a public introduction at the industry's SEMICON West trade show in July.