Press release - Tempe, Arizona, August 17, 2000
Continuing to gain market momentum for its new 300 mm lithography platform, ASML has received another order for multiple TWINSCAN systems from a first-time customer. The customer is a leading US semiconductor manufacturer who will use the equipment for volume manufacture of advanced logic devices. The first unit in this order is scheduled for installation by the end of the year with volume production beginning in 2001.
"We are very pleased to be working with this new customer," said Dave Chavoustie, ASML's executive vice president of worldwide sales. "ASML has developed a significant new technology that will enable IC makers to realize the true productivity gains inherent in 300 mm volume production while operating at the limits of optical lithography."
This is the third TWINSCAN order announced within the past two months. ASML publicly introduced its new 300 mm system at the SEMICON West trade show in July. TWINSCAN is specifically designed for 300 mm wafer processing and incorporates fundamental innovations in system architecture and stage design to meet the highest productivity requirements. It is designed to support multiple generations of optical lithography technologies from i-line to 157 nm.
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